- Kapton Tape | Polyimide Tape
- 【Brief 】：
Kapton Tape(Polyimide Tape) is made of Kapton polyimide film with silicone adhesive.
Adhesive: Silicone single-sided or Double-sided
Resist Temperature: -73℃-280℃
Color: Amber | Black
Thickness(mm): 0.04 | 0.05 | 0.06 | 0.08 | 0.1 | 0.12
Die-cutting: Any shapes and sizes
- 【Series】：Kapton Tape
- Product description
Single-sided Kapton tape is made of Kapton polyimide film with silicone adhesive single-sided.
Single-sided Kapton Tape Structure
Single-sided Technical Data Sheet
Tape No. ZD-03 ZD-04 ZD-06 ZD-08 ZD-10 ZD-12 ZD ESD Kapton tape Backing Thick (mm) 0.012 0.025 0.025 0.05 0.05 0.075 0.025 Total Thick (mm) 0.035 0.04 0.06 0.08 0.1 0.12 0.06 Adhesion to Steel (N/25MM) GB/T72792-1998 ≧4.5 ≧6 ≧6 ≧6 ≧ 7 ≧ 7 ≧6 Tensile Strength (N/25MM) 115 120 115 Color Amber (common) & Black Resist Temperature -73℃-280℃ Insulation Stage (MΩ) 10^6-10^9 No Anti-Static Stage No 10^6-10^9
Double-sided Kapton tape is made of Kapton polyimide film with silicone adhesive double-sided.
Structure
S01-06L single-sided with liner structure Double-sided Kapton Tape Structure
Data Sheet
Kapton Tape No. ZD-06L ZD-2590 ZD-5020 ZD-7520 Backing Thick (mm) 0.025 0.025 0.05 0.075 Total Thick (mm) 0.06 0.09 0.2 0.2 Liner Thick (mm) 0.05mm & 0.075mm Adhesion to Steel (N/25MM) GB/T72792-1998 ≧6 ≧7 ≧7 ≧7 Tensile Strength (N/25MM) 115 110 110 115 Color Amber & Dark Amber Resist Temperature -73℃-280℃ Insulation Stage (MΩ) 10^6-10^9
Features:
- Heat resistant silicone adhesive polyimide tape.
- High Temperature Resist, solvent resistant, stable and reliable.
- Easy peel off no glue residue.
- H-class insulation.
- Suitable for PCB 3D printing and transformer insulation.
- Strong tensile strength.
- Offer sheet or roll material or diecut processing.
Application:
With high temperature resist ( 260°C/500°F) and H-class insulation Feature, It mainly applies to PCB solder masking, powder coating, lithium battery, Cable bonding, SMT surface mounting, transformer manufacturing, 3D printing, etc.
- Mask the PCB before the wave or coating process to protect the components on the PCB.
- Efficient Heat Transfer Path between Heat Generating Components and Heat Sinks, Fans, Heat Spreaders, Heat pipes.General Heat Sink Bonding.
- IC Chip Packing Heat Construction.
- Printed Circuit Board.
- LED Module / Board Bonding.
- Flat Panel Display TV as LCD, LED, PDP.
- COF Chip Heat Construction.
- Electronic circuit board wave soldering masking, electrical insulation, and high-end finger protection.
- Automotive Electronic Thermal Management such as Engine Control Units, ABS System, Gear Control Units.
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